Three-dimensional integrated circuit design : EDA, design and microarchitectures edited by
Xie, Yuan
Three-dimensional integrated circuit design : EDA, design and microarchitectures edited by Yuan Xie, Jason Cong and Sachin Sapatnekar - New York Springer 2010 - 284 p. - Integrated circuits and systems. .
"This book provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, the possible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level. The work covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for 3D microarchitecture. The book includes an introduction on the background of 3D IC, a motivation that explains why the 3D IC is important and how it will trend, 3D process (fabrication) options, 3D EDA algorithms and tools (physical level and architectural level tools), 3D microarchitecture, including 3D FPGA, 3D single core/multi core processors, 3D Network-onchip designs"--Publisher description
9781441907837
Integrated circuits--Design and construction
Optical materials
Surfaces (Physics)
Electronics
Engineering
Three-dimensional modeling
621.381 XIE-Y
Three-dimensional integrated circuit design : EDA, design and microarchitectures edited by Yuan Xie, Jason Cong and Sachin Sapatnekar - New York Springer 2010 - 284 p. - Integrated circuits and systems. .
"This book provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, the possible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level. The work covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for 3D microarchitecture. The book includes an introduction on the background of 3D IC, a motivation that explains why the 3D IC is important and how it will trend, 3D process (fabrication) options, 3D EDA algorithms and tools (physical level and architectural level tools), 3D microarchitecture, including 3D FPGA, 3D single core/multi core processors, 3D Network-onchip designs"--Publisher description
9781441907837
Integrated circuits--Design and construction
Optical materials
Surfaces (Physics)
Electronics
Engineering
Three-dimensional modeling
621.381 XIE-Y