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Area array packaging handbook

Area array packaging handbook by Ken Gilleo. - New York, N.Y. McGraw-Hill Education, 2002

ISBN: 9780071374934

Subjects--Topical Terms:
Ball grid array technology. Microelectronic packaging. Electronics industries. Electronic packaging. Integrated circuits industry. Flip chip technology. Polymers. Electronics Hermetic sealing. Adhesives. Solder and soldering. Multichip modules (Microelectronics) Screen process printing. Software measurement. Electronic apparatus and appliances Surface mount technology.

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