Wire bonding in microelectronics

Wire bonding in microelectronics by George G. Harmon. - 3rd ed. - New York McGraw-Hill, 2010

9780071476232


Wire bonding (Electronic packaging) Electronic packaging Electronic packaging Semiconductors
An institution deemed to be a University Estd. Vide Sec.3 of the UGC
Act,1956 under notification # F.12-23/63.U-2 of Jun 18,1964

© 2024 BITS-Library, BITS-Hyderabad, India.