MARC details
| 000 -LEADER |
|---|
| fixed length control field |
03278cam a22003618i 4500 |
| 001 - CONTROL NUMBER |
|---|
| control field |
20412244 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20190330113125.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
180319s2018 flu b 001 0 eng |
| 010 ## - LIBRARY OF CONGRESS CONTROL NUMBER |
|---|
| LC control number |
2018010530 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9781138710399 (hardback : acidfree paper) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| Canceled/invalid ISBN |
9781315200699 (ebook) |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
DLC |
| Language of cataloging |
eng |
| Description conventions |
rda |
| Transcribing agency |
DLC |
| 042 ## - AUTHENTICATION CODE |
|---|
| Authentication code |
pcc |
| 050 00 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
TK7874.893 |
| Item number |
.A16 2018 |
| 082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.395 SAK-K |
| Edition number |
23 |
| 100 ## - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Sakuma, Katsuyuki |
| 245 00 - TITLE STATEMENT |
|---|
| Title |
3D integration in VLSI circuits : |
| Remainder of title |
implementation technologies and applications / |
| Statement of responsibility, etc. |
[edited by] Katsuyuki Sakuma. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) |
|---|
| Place of publication, distribution, etc. |
Boca Raton |
| Name of publisher, distributor, etc. |
CRC Press |
| Date of publication, distribution, etc. |
2018 |
| 263 ## - PROJECTED PUBLICATION DATE |
|---|
| Projected publication date |
1807 |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
217 p. |
| 365 ## - TRADE PRICE |
|---|
| Price type code |
GBP |
| Price amount |
110.00 |
| 490 0# - SERIES STATEMENT |
|---|
| Series statement |
Devices, circuits, & systems |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc |
Includes bibliographical references and index. |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
3D Integration: Technology and Design / P. Franzon -- 3D SiP for ASIC and 3D DRAM Integration / L. Li -- A New Class of High-capacity, Resource-rich FPGAs Enabled by 3D-IC Stacked Silicon Interconnect Technology (SSIT) / S. Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden -- Challenges in 3D / M. Koyanagi, T. Fukushima, and T. Tanaka -- Wafer-Level Three-Dimensional Integration (3DI) using Bumpless Interconnects and Ultra-Thinning / T. Ohba -- 3DI stacking technologies for high volume manufacturing by use of wafer level oxide bonding integration / S. Skordas, K. Sakuma, K. Winstel, and C. Kothandaraman -- Toward 3D high density / S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio -- Novel Platforms and Applications Using 3D and Heterogeneous Integration Technologies / K-N. Chen, Ting-Yang Yu, Yu-Chen Hu, Cheng-Hsien Lu. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc. |
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe-- |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Three-dimensional integrated circuits. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Integrated circuits |
| General subdivision |
Very large scale integration. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Sakuma, Katsuyuki, |
| Relator term |
author. |
| 906 ## - LOCAL DATA ELEMENT F, LDF (RLIN) |
|---|
| a |
7 |
| b |
cbc |
| c |
orignew |
| d |
1 |
| e |
ecip |
| f |
20 |
| g |
y-gencatlg |
| 955 ## - COPY-LEVEL INFORMATION (RLIN) |
|---|
| Book number/undivided call number, CCAL (RLIN) |
rk21 2018-03-19 |
| Copy information and material description, CCAL + MDES (RLIN) |
rk21 2018-03-19 to rk09 for review |
| 952 ## - LOCATION AND ITEM INFORMATION (KOHA) |
|---|
| Withdrawn status |
|
