3D Microelectronic Packaging : From Architectures to Applications (Record no. 87479)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00674nam a2200145Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 2212144s2021 xx 000 0 und d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9789811570902 |
| 041 ## - LANGUAGE CODE | |
| Language code of text/sound track or separate title | eng |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Yan Li, Deepak Goyal. |
| 245 ## - TITLE STATEMENT | |
| Title | 3D Microelectronic Packaging : From Architectures to Applications |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 2nd ed. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication, distribution, etc. | Singapore |
| Name of publisher, distributor, etc. | Springer |
| Date of publication, distribution, etc. | 2021 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Electronic circuits. Electronics. Optical materials. Microtechnology. Microelectromechanical systems. Metals. Electronic Circuits and Systems. Electronics and Microelectronics, Instrumentation. Optical Materials. Microsystems and MEMS. Metals and Alloys. |
| 856 ## - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="https://doi.org/10.1007/978-981-15-7090-2">https://doi.org/10.1007/978-981-15-7090-2</a> |
| Withdrawn status | Lost status | Damaged status | Not for loan | Home library | Current library | Date acquired | Total Checkouts | Barcode | Date last seen | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BITS Pilani Hyderabad | BITS Pilani Hyderabad | 16/12/2022 | EBK004244 | 16/12/2022 | 16/12/2022 | Springer EBooks |