TY  - BOOK
AU  - Chen, Andrea
AU  - Lo, Randy Hsiao-Yu.
TI  - Semiconductor packaging : materials interaction and reliability
SN  - 9781439862056
U1  - 621.38152 CHE-A 
PY  - 2012///
CY  - Boca Raton
PB  - CRC Press
KW  - Technology and engineering / Material Science ﾠ
KW  - Technology and engineering / Electronics / Circuits / General ﾠ
KW  - Technology and engineering / Electronics / General ﾠ
KW  - Microelectronic packaging ﾠ
ER  -