TY  - BOOK
AU  - Xie, Yuan
AU  - Cong, Jason
AU  - Sapatnekar, Sachin 
TI  - Three-dimensional integrated circuit design: EDA, design and microarchitectures edited by
SN  - 9781441907837
U1  - 621.381 XIE-Y 
PY  - 2010///
CY  - New York
PB  - Springer
KW  - Integrated circuits--Design and construction
KW  - Optical materials
KW  - Surfaces (Physics)
KW  - Electronics
KW  - Engineering
KW  - Three-dimensional modeling
N1  - 	
"This book provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, the possible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level. The work covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for 3D microarchitecture. The book includes an introduction on the background of 3D IC, a motivation that explains why the 3D IC is important and how it will trend, 3D process (fabrication) options, 3D EDA algorithms and tools (physical level and architectural level tools), 3D microarchitecture, including 3D FPGA, 3D single core/multi core processors, 3D Network-onchip designs"--Publisher description
ER  -