TY  - BOOK
AU  - Chakravarti V. Madhusudana
TI  - Thermal Contact Conductance
SN  - 9783319012766
PY  - 2014///
CY  - Berlin Heidelberg
PB  - Springer
KW  - Heat and Mass Transfer Engineering: Engineering Thermodynamics
UR  - http://doi.org/10.1007/978-3-319-01276-6
ER  -