TY  - BOOK
AU  - Preeti S Chauhan ; Anupam Choubey Michael G Pecht ZhaoWei Zhong
TI  - Copper Wire Bonding
SN  - 9781461457619
PY  - 2014///
CY  - New York
PB  - Springer
KW  - Engineering: Mechatronics: Optical and Electronic Materials
UR  - http://doi.org/10.1007/978-1-4614-5761-9
ER  -