Brandon Noia ; Krishnendu Chakrabarty <br/><br/>
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs 

 - Berlin Heidelberg  Springer  2014 
<br/><br/><label>ISBN: </label>9783319023786 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Engineering: Circuits and Systems: Processor Architectures: Semiconductors