TY  - BOOK
AU  - Brandon Noia ; Krishnendu Chakrabarty
TI  - Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
SN  - 9783319023786
PY  - 2014///
CY  - Berlin Heidelberg
PB  - Springer
KW  - Engineering: Circuits and Systems: Processor Architectures: Semiconductors
UR  - http://doi.org/10.1007/978-3-319-02378-6
ER  -