TY  - BOOK
AU  - John H. Lau, Ning-Cheng Lee.
TI  - Assembly and Reliability of Lead-Free Solder Joints
SN  - 9789811539206
PY  - 2020///
CY  - Singapore
PB  - Springer
KW  - Electronics. Microelectronics. Electronic circuits. Electronics and Microelectronics, Instrumentation. Circuits and Systems
UR  - https://doi.org/10.1007/978-981-15-3920-6
ER  -