Yan Li, Deepak Goyal. <br/><br/>
3D Microelectronic Packaging : From Architectures to Applications 

 - 2nd ed. 
 - Singapore  Springer  2021 
<br/><br/><label>ISBN: </label>9789811570902 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic circuits. Electronics. Optical materials. Microtechnology. Microelectromechanical systems. Metals. Electronic Circuits and Systems. Electronics and Microelectronics, Instrumentation. Optical Materials. Microsystems and MEMS. Metals and Alloys.