TY  - BOOK
AU  - Yan Li, Deepak Goyal.
TI  - 3D Microelectronic Packaging : From Architectures to Applications
SN  - 9789811570902
PY  - 2021///
CY  - Singapore
PB  - Springer
KW  - Electronic circuits. Electronics. Optical materials. Microtechnology. Microelectromechanical systems. Metals. Electronic Circuits and Systems. Electronics and Microelectronics, Instrumentation. Optical Materials. Microsystems and MEMS. Metals and Alloys
UR  - https://doi.org/10.1007/978-981-15-7090-2
ER  -