Area array packaging handbook 
by Ken Gilleo. 
 - New York, N.Y.  McGraw-Hill Education,  2002 
<br/><br/><label>ISBN: </label>9780071374934 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Ball grid array technology. Microelectronic packaging. Electronics industries. Electronic packaging. Integrated circuits industry. Flip chip technology. Polymers. Electronics Hermetic sealing. Adhesives. Solder and soldering. Multichip modules (Microelectronics) Screen process printing. Software measurement. Electronic apparatus and appliances Surface mount technology.