TY  - BOOK
TI  - Area array packaging handbook
SN  - 9780071374934
PY  - 2002///
CY  - New York, N.Y.
PB  - McGraw-Hill Education
KW  - Ball grid array technology. Microelectronic packaging. Electronics industries. Electronic packaging. Integrated circuits industry. Flip chip technology. Polymers. Electronics Hermetic sealing. Adhesives. Solder and soldering. Multichip modules (Microelectronics) Screen process printing. Software measurement. Electronic apparatus and appliances Surface mount technology
UR  - https://www.accessengineeringlibrary.com/content/book/9780071374934
ER  -