TY  - BOOK
TI  - Wire bonding in microelectronics
SN  - 9780071476232
PY  - 2010///
CY  - New York
PB  - McGraw-Hill
KW  - Wire bonding (Electronic packaging) Electronic packaging Electronic packaging Semiconductors
UR  - https://www.accessengineeringlibrary.com/content/book/9780071476232
ER  -