Reliability of RoHS-Compliant 2D and 3D IC interconnects 
by John H. Lau. 
 - New York, N.Y.  McGraw-Hill Education,  2011 
<br/><br/><label>ISBN: </label>9780071753791 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Interconnects (Integrated circuit technology) Green technology