TY  - BOOK
TI  - Reliability of RoHS-Compliant 2D and 3D IC interconnects
SN  - 9780071753791
PY  - 2011///
CY  - New York, N.Y.
PB  - McGraw-Hill Education
KW  - Interconnects (Integrated circuit technology) Green technology
UR  - https://www.accessengineeringlibrary.com/content/book/9780071753791
ER  -