TY  - BOOK
TI  - Through-Silicon Vias for 3D Integration
SN  - 9780071785143
PY  - 2013///
CY  - New York, N.Y.
PB  - McGraw-Hill Education
KW  - Three-dimensional integrated circuits
UR  - https://www.accessengineeringlibrary.com/content/book/9780071785143
ER  -