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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Material type:
TextLanguage: English Publication details: Berlin Heidelberg Springer 2014ISBN: - 9783319023786
| Item type | Current library | Call number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|
Springer EBooks
|
BITS Pilani Hyderabad | Available | EBK000865 |
Total holds: 0
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