000			03278cam a22003618i 4500
999			_c39385 _d39385
001			20412244
005			20190330113125.0
008			180319s2018 flu b 001 0 eng
010			_a 2018010530
020			_a9781138710399 (hardback : acidfree paper)
020			_z9781315200699 (ebook)
040			_aDLC _beng _erda _cDLC
042			_apcc
050	0	0	_aTK7874.893 _b.A16 2018
082	0	0	_a621.395 SAK-K _223
100			_aSakuma, Katsuyuki
245	0	0	_a3D integration in VLSI circuits : _bimplementation technologies and applications / _c[edited by] Katsuyuki Sakuma.
260			_aBoca Raton _bCRC Press _c2018
263			_a1807
300			_a217 p.
365			_aGBP _b110.00
490	0		_aDevices, circuits, & systems
504			_aIncludes bibliographical references and index.
505	0		_a3D Integration: Technology and Design / P. Franzon -- 3D SiP for ASIC and 3D DRAM Integration / L. Li -- A New Class of High-capacity, Resource-rich FPGAs Enabled by 3D-IC Stacked Silicon Interconnect Technology (SSIT) / S. Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden -- Challenges in 3D / M. Koyanagi, T. Fukushima, and T. Tanaka -- Wafer-Level Three-Dimensional Integration (3DI) using Bumpless Interconnects and Ultra-Thinning / T. Ohba -- 3DI stacking technologies for high volume manufacturing by use of wafer level oxide bonding integration / S. Skordas, K. Sakuma, K. Winstel, and C. Kothandaraman -- Toward 3D high density / S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio -- Novel Platforms and Applications Using 3D and Heterogeneous Integration Technologies / K-N. Chen, Ting-Yang Yu, Yu-Chen Hu, Cheng-Hsien Lu.
520			_aCurrently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe--
650		0	_aThree-dimensional integrated circuits.
650		0	_aIntegrated circuits _xVery large scale integration.
700	1		_aSakuma, Katsuyuki, _eauthor.
906			_a7 _bcbc _corignew _d1 _eecip _f20 _gy-gencatlg
955			_brk21 2018-03-19 _crk21 2018-03-19 to rk09 for review