| 000 | 00513nam a2200133Ia 4500 | ||
|---|---|---|---|
| 008 | 2212144s2020 xx 000 0 und d | ||
| 020 | _a9789811539206 | ||
| 041 | _aeng | ||
| 100 | _aJohn H. Lau, Ning-Cheng Lee. | ||
| 245 | _aAssembly and Reliability of Lead-Free Solder Joints | ||
| 260 |
_aSingapore _bSpringer _c2020 |
||
| 650 | _aElectronics. Microelectronics. Electronic circuits. Electronics and Microelectronics, Instrumentation. Circuits and Systems. | ||
| 856 | _uhttps://doi.org/10.1007/978-981-15-3920-6 | ||
| 999 |
_c85992 _d85992 |
||