| 000 | 00753nam a2200121Ia 4500 | ||
|---|---|---|---|
| 008 | 221214s2002 xx 000 0 und d | ||
| 020 | _a9780071374934 | ||
| 041 | _aeng | ||
| 245 |
_aArea array packaging handbook _cby Ken Gilleo. |
||
| 260 |
_aNew York, N.Y. _bMcGraw-Hill Education, _c2002 |
||
| 650 | _aBall grid array technology. Microelectronic packaging. Electronics industries. Electronic packaging. Integrated circuits industry. Flip chip technology. Polymers. Electronics Hermetic sealing. Adhesives. Solder and soldering. Multichip modules (Microelectronics) Screen process printing. Software measurement. Electronic apparatus and appliances Surface mount technology. | ||
| 856 | _uhttps://www.accessengineeringlibrary.com/content/book/9780071374934 | ||
| 999 |
_c89497 _d89497 |
||