| 000 | 00491nam a2200133Ia 4500 | ||
|---|---|---|---|
| 008 | 221214s2010 xx 000 0 und d | ||
| 020 | _a9780071476232 | ||
| 041 | _aeng | ||
| 245 |
_aWire bonding in microelectronics _cby George G. Harmon. |
||
| 250 | _a3rd ed. | ||
| 260 |
_aNew York _bMcGraw-Hill, _c2010 |
||
| 650 | _aWire bonding (Electronic packaging) Electronic packaging Electronic packaging Semiconductors | ||
| 856 | _uhttps://www.accessengineeringlibrary.com/content/book/9780071476232 | ||
| 999 |
_c89608 _d89608 |
||