Library Working Hours During Recess
Monday to Friday	09:00 AM - 07:00 PM
Saturday	09:00 AM - 05:00 PM
Sundays & Holidays	Closed

Patron Checkouts
Patrons	No. of Books Issued	Loan Period	Overdue Charges
Faculty	25	6 months	Nil
Students	10	2 Weeks	Re. 1 Per Book Per Day
Research Scholars	15	30 Days	Nil
Staff	5	30 Days	Nil

Normal view MARC view ISBD view

Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration by John H. Lau. - New York, N.Y. McGraw-Hill Education, 2013

ISBN: 9780071785143

Subjects--Topical Terms:
Three-dimensional integrated circuits.

Print
Add to your cart (remove)
Send to device
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)