Image from Amazon.com
Through-Silicon Vias for 3D Integration by John H. Lau.
Material type:
TextLanguage: English Publication details: New York, N.Y. McGraw-Hill Education, 2013ISBN: - 9780071785143
| Item type | Current library | Call number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|
McGraw Hill Ebook
|
BITS Pilani Hyderabad | Available | MCW000491 |
Total holds: 0
There are no comments on this title.
Log in to your account to post a comment.