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Reliability of RoHS-Compliant 2D and 3D IC interconnects by John H. Lau.

Material type: TextTextLanguage: English Publication details: New York, N.Y. McGraw-Hill Education, 2011ISBN:
  • 9780071753791
Subject(s): Online resources:
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Holdings
Item type Current library Call number Status Date due Barcode Item holds
McGraw Hill Ebook McGraw Hill Ebook BITS Pilani Hyderabad Available MCW000446
Total holds: 0

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