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Your search returned 14 results.

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	1.	Optoelectronic packaging / Alan R. Mickelson and others by Mickelson, Alan R Material type: Text; Format: print ; Literary form: Not fiction Language: ENG Publication details: NY Wiley 1997 Availability: Items available for loan: BITS Pilani Hyderabad (1)Location, call number: General Stack (For lending) 621.381045 MIC-A. Add to cart (remove)
	2.	MEMS and microsystems : design and manufacture / Tai-Ran Hsu by Hsu, Tai-Ran Material type: Text; Format: print ; Literary form: Not fiction Language: ENG Publication details: India Tata McGraw-Hill 2002 Availability: Items available for loan: BITS Pilani Hyderabad (5)Location, call number: Text & Reference Section (Student cannot borrow these books) 621.381 HSU-T, ... Not available: BITS Pilani Hyderabad: Checked out (1). Add to cart (remove)
	3.	Fundamentals of microfabrication : the science of miniaturization / Marc J. Madou by Madou, Marc J Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction Language: ENG Publication details: Boca Raton CRC Press 2002 Availability: Items available for loan: BITS Pilani Hyderabad (2)Location, call number: Text & Reference Section (Student cannot borrow these books) 621.38152 MAD-M, ... Not available: BITS Pilani Hyderabad: Checked out (1). Add to cart (remove)
	4.	Semiconductor packaging : materials interaction and reliability / Andrea Chen and Randy Hsiao-Yu Lo by Chen, Andrea Lo, Randy Hsiao-Yu Material type: Text; Format: print ; Literary form: Not fiction Language: ENG Publication details: Boca Raton CRC Press 2012 Availability: Items available for loan: BITS Pilani Hyderabad (1)Location, call number: General Stack (For lending) 621.38152 CHE-A. Add to cart (remove)
	5.	Microvias for low-cost, high-density interconnects by John H. Lau, S.W. Ricky Lee. Material type: Text; Format: print ; Literary form: Not fiction Language: English Publication details: New York, N.Y. McGraw-Hill Education, 2001 Online resources: Click here to access online Availability: Items available for loan: BITS Pilani Hyderabad (1). Add to cart (remove)
	6.	Fundamentals of microsystems packaging by Rao R. Tummala. Material type: Text; Format: print ; Literary form: Not fiction Language: English Publication details: New York, N.Y. McGraw-Hill Education, 2001 Online resources: Click here to access online Availability: Items available for loan: BITS Pilani Hyderabad (1). Add to cart (remove)
	7.	Area array packaging handbook by Ken Gilleo. Material type: Text; Format: print ; Literary form: Not fiction Language: English Publication details: New York, N.Y. McGraw-Hill Education, 2002 Online resources: Click here to access online Availability: Items available for loan: BITS Pilani Hyderabad (1). Add to cart (remove)
	8.	Electronics manufacturing with lead-free, halogen-free, and conductive-adhesive materials by John H. Lau . [et al.]. Material type: Text; Format: print ; Literary form: Not fiction Language: English Publication details: New York, N.Y. McGraw-Hill Education, 2003 Online resources: Click here to access online Availability: Items available for loan: BITS Pilani Hyderabad (1). Add to cart (remove)
	9.	Electronic materials and processes handbook by Charles A. Harper Edition: 3rd ed. Material type: Text; Format: print ; Literary form: Not fiction Language: English Publication details: New York McGraw-Hill, 2003 Online resources: Click here to access online Availability: Items available for loan: BITS Pilani Hyderabad (1). Add to cart (remove)
	10.	Semiconductor manufacturing handbook by Hwaiyu Geng. Material type: Text; Format: print ; Literary form: Not fiction Language: English Publication details: New York, N.Y. McGraw-Hill Education, 2005 Online resources: Click here to access online Availability: Items available for loan: BITS Pilani Hyderabad (2). Add to cart (remove)
	11.	Introduction to system-on-package (SOP)miniaturization of the entire system by Rao R. Tummala, Madhavan Swaminathan. Material type: Text; Format: print ; Literary form: Not fiction Language: English Publication details: New York, N.Y. McGraw-Hill Education, 2008 Online resources: Click here to access online Availability: Items available for loan: BITS Pilani Hyderabad (1). Add to cart (remove)
	12.	Microprocessor design a practical guide from design planning to manufacturing by Grant McFarland. Material type: Text; Format: print ; Literary form: Not fiction Language: English Publication details: New York, N.Y. McGraw-Hill Education, 2006 Online resources: Click here to access online Availability: Items available for loan: BITS Pilani Hyderabad (1). Add to cart (remove)
	13.	Advanced MEMS packaging by John H. Lau . [et al.]. Material type: Text; Format: print ; Literary form: Not fiction Language: English Publication details: New York, N.Y. McGraw-Hill Education, 2010 Online resources: Click here to access online Availability: Items available for loan: BITS Pilani Hyderabad (1). Add to cart (remove)
	14.	Fundamentals of Device and Systems Packaging: Technologies and Applications by Rao Tummala. Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction Language: English Publication details: New York, N.Y. McGraw-Hill Education, 2019 Online resources: Click here to access online Availability: Items available for loan: BITS Pilani Hyderabad (1). Add to cart (remove)

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